DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Grinding

Solutions


Applications Example


High Quality Processing of InP (Indium Phosphide)
 
Optimization of wheels and processing parameters enables high quality processing of InP (indium phosphide) used in high-speed devices.
Selection of optical processing parameters improves the condition of the processed surface compared with the existing method.
Before the improvement After the improvement
改善前の加工面 改善後の加工面
Figure 1: Microscope Images of the Processed Surface
 3インチInPウェーハ加工後(加工条件最適化後)の面粗さ
Reference: Surface Roughness after Processing a 3-inch InP Wafer
(After Optimizing the Processing Parameters)
Surface roughness Ra: 0.004 µm
Surface roughness Ry: 0.033 µm
  Solutions

Kiru, Kezuru, Migaku Topics
 
 
Applications Example
 
 
Solutions Support
 
 

Personal Information Protection Policy
User Agreement
Contact
Back To Top