Various workpiece shapes such as small round, oval and rectangular are applicable. (Either the 8- or 12-inch chuck table can be selected.)
Workpieces actually processed
Workpiece (molded die) largely warped due to the stress that occurred during resin coating after packaging, a quartered Si wafer, Si die, LT package substrate, gallium arsenic base, sapphire base, etc.
This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.