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Applications Example


Multiple Workpieces Grinding
 
As a sequel to grinding using the frame chuck (Updated in August 2005), the simultaneous multiple-piece grinding using the frame chuck is introduced this time.


Simultaneous multiple-piece grinding method
Mount multiple workpieces on the tape affixed to the dicing frame, secure it to the DAG810 chuck table and perform grinding.
Simultaneous multiple-piece grinding frame chuck diagram

Applicable workpieces
Various workpiece shapes such as small round, oval and rectangular are applicable. (Either the 8- or 12-inch chuck table can be selected.)

Workpieces actually processed
Workpiece (molded die) largely warped due to the stress that occurred during resin coating after packaging, a quartered Si wafer, Si die, LT package substrate, gallium arsenic base, sapphire base, etc.
This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.
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