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Applications Example

High-Quality Grinding of Lithium Tantalate
 
This application example will introduce high-quality processing as a continuation of the feature on Lithium Tantalate (LT) processing first introduced in April 2006.


Processing Example
Higher quality processing is now possible for 4-inch LT wafers used in SAW device substrates and other components.

Surface Roughness Data
The surface roughness values are approximately Ra: 0.002 µm, and Ry: 0.017 µm.
Surface After Processing
Conventional processed surface
Conventional processed surface
High-quality processed surface
High-quality processed surface
Process Results
The amount of the wheel wear is about 2µm during about four minutes per 10µm amount of grinding in the processing time of 4-inch LT wafer.
Moreover, processing results of 30 µm amount ground and 110µm final thickness have been achieved.
  Solutions
Kiru, Kezuru, Migaku Topics
  
 
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