DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Grinding

Solutions

Applications Example

TAIKO Process Grinding Quality
 
The surface roughness of the TAIKO process grinding is shown below.

Process Example
In the TAIKO process, a special wheel is used to grind the wafer.

Photo 1: Special Wheel for the TAIKO Process
Figs. 1 and 2 show the surface roughness when grinding with a standard wheel in the TAIKO process.
This shows that the same surface roughness as that of a #2000 wheel is obtained.
Fig. 1: Comparison of Surface Roughness (Ra)
Fig. 2: Comparison of Surface Roughness (Ry)
Measuring instrument: Surfcorder ET4100S by Kosaka Laboratory Ltd.
Reference Information
Merits of TAIKO Grinding
TAIKO Process



Solutions
Kiru, Kezuru, Migaku Topics
  
 
Applications Example
  
 
Solutions Support
  
 

Personal Information Protection Policy
User Agreement
Contact
Copyright (C) DISCO Corporation All rights reserved.
Back To Top