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Applications Example


TAIKO Process Grinding Quality
 
The surface roughness of the TAIKO process grinding is shown below.

Process Example
In the TAIKO process, a special wheel is used to grind the wafer.

Photo 1: Special Wheel for the TAIKO Process
Figs. 1 and 2 show the surface roughness when grinding with a standard wheel in the TAIKO process.
This shows that the same surface roughness as that of a #2000 wheel is obtained.
Fig. 1: Comparison of Surface Roughness (Ra)
Fig. 2: Comparison of Surface Roughness (Ry)
Measuring instrument: Surfcorder ET4100S by Kosaka Laboratory Ltd.
Reference Information
TAIKO Process



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