Solutions

Applications Example

Features of the New UltraPoligrind wheel

DISCO has developed the UltraPoligrind (Photo 1) as a new solution for the silicon wafer thinning process.

Process Example

UltraPoligrind is a new grinding wheel with fixed abrasive grains that realizes an ultrafine finish.
It maintains die strength and a sufficient gettering effect* during the silicon wafer thinning process.


*	The gettering effect is a mechanism that moves crystal defects and contaminations into the silicon wafer bulk or backside to capture and immobilize the impurities at these gettering sites.

Photo 1: UltraPoligrind

Compared to our previous Poligrind wheel, the UltraPoligrind has a depth of damage that is about half that of the Poligrind to maintain die strength and a sufficient gettering effect.

	UltraPoligrind	Poligrind	Dry Polish
Depth of damage
Surface roughness

As for die strength (based on the ball-bending test), approximately the same minimum values as those of the standard dry polish method were obtained for stress relief. (Fig. 1)