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Introduction of the Gettering DP wheel
 
When the silicon wafer is polished, there has been a problem to date where the gettering effect*1 is lost while die strength rose.
This introduces the Gettering DP wheel that enables polishing that combines high die strength and the gettering effect.


*1 The gettering effect is a mechanism that forms crystal defects or distortions (= gettering sites) inside the silicon wafer (bulk or backside) and then captures impurities in these gettering sites.
Gettering DP wheel introduced this time forms the gettering site due minute scars on the wafer backside, capturing the heavy-metal impurities.


Photo.1 Gettering effect diagram
(This drawing is made by DISCO.)
Conventionally: Approached from the grinding processing.
DISCO lineup includes the UltraPoligrind (hereafter UPG) that achieves high die strength while maintaining the gettering effect.
It is necessary to modify the Z3-axis grinding specification of DGP8760 and DGP8761 fully automatic grinder polishers to realize die strength equal or better than the Gettering DP.


Gettering DP: Approached from polishing
Gettering DP can be installed as it is to the Z3-axis DP specification that is standard on the DGP8760 and DGP8761 with the DP wheel that can achieve the gettering effect while maintaining die strength (minimum value) equal to the UPG level.


<Gettering DP processing results>
The depth of damage with Gettering DP is about 50nm same as UPG. Moreover, the UPG surface is rough due to grinding with abrasive grains as opposed to the Gettering DP mirror surface from the polishing process.

Photo.2 Cross sections of UPG and Gettering DP

Photo.3 Surface roughness with UPG and Gettering DP

In die strength (ball-bending), Minimum value almost equal to the stress relief by UPG is achieved. (Figure.1)

Figure. 1 Die Strength Comparison
For detailed process methods, please contact the head office Applications R&D Department.



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