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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics

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Kiru, Kezuru, Migaku Topics
The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG Others
DBG is a process that first half-cuts the wafer and then separates the die during backside grinding. This is a reverse of the standard process where backside grinding is carried out before wafer cutting. It is capable of significantly lowering the risk of wafer breakage during grinding and handling, and of lowering backside chipping during die separation.
Dicing Before Grinding (DBG) Process
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