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DBG & Dry Etcher Process Flow

When the dry etcher is combined with the DBG process, it can improve die strength even further than when processing with common grinding, because the etcher can remove the die side surface damage from blade dicing.
Also, with this process, there is no mechanical damage due to dicing, because the stress relief process is performed after die separation has taken place.
As a result, this process shows promise in reliability improvement of those devices that undergo external stress after packaging, such as IC cards.