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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics

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Kiru, Kezuru, Migaku Topics
The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG Others
Introducing various grinding wheels and handling mechanisms to support the increase in demand for less than 100 µm thin grinding, and newly developed wafer grinding technologies.
Ultra-Thin Grinding
TAIKO Process
Solutions
Kiru, Kezuru, Migaku Topics
  
 
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