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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics > Florescent resin color stabilization using the Surface Planer

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Florescent resin color stabilization using the Surface Planer

The flatness of the fluorescent resin that covers an LED die effects stability of the color of the light emitted from the LED.
The surface planer allows high precision planarization of this florescent resin, thus stabilizing and improving color irregularities. This process is also effective in the case of flip chip LEDs.


Processing Mechanism
A diamond bit is attached to the surface planer spindle, which stands parallel to the processing stage. The workpiece is secured to the stage by vacuum suction, and the surface of the workpiece is planarized in micrometer increments. This allows planarization of the micrometer-scale indentations on the wafer surface.

LED resin processing cross section diagram
LED resin processing cross section diagram
Before Processing
After processing
Florescent resin thickness variation: 60-100µm Florescent resin thickness variation: 1µm or less
Planarization results in enhance florescence,
thus reducing color variation between LED die.

Comparison of LED resin color distribution before and after processing
Before processing
Before processing
After processing
After processing


Compatible equipment
DFS8910 DAS8920
DFS8910
8-inch wafer compatible fully-automatic model
DAS8920
8-inch wafer compatible semi-automatic model
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