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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics > SDBG (Stealth Dicing Before Grinding) Process

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SDBG (Stealth Dicing Before Grinding) Process

Smartphones and tablets are continually becoming thinner and supporting a higher processing capacity, which means that flash memory and memory controller chips must also become thinner. Current processes are focused on reducing chipping and improving thin wafer handling.
The SDBG process was developed in order to address these issues, making it possible to:
  • increase the number of die per wafer;
  • improve the die strength of thin die.


What is the SDBG Process?
SDBG is the process of performing backside grinding after stealth dicing. It produces narrow streets on thin die and improves die strength.
Using a die separator (DDS2300) after SDBG, it is possible to precisely separate the DAF (die attach film) which is used as a bonding material when laminating thin die.
Process Flow
SDBG (Stealth Dicing Before Grinding) Process
Increased Number of Die per Wafer
Kerfs generated during stealth dicing are extremely narrow. Thus, stealth dicing contributes to producing narrower streets. It is expected to increase the number of die yielded from each wafer compared to the conventional dicing process.
Photograph after separation Example comparison of No. of die
Die Strength Improvement
In conventional blade dicing, front and backside chipping and processing marks remaining on the side wall can affect die strength.
In the SDBG process, die separation is performed at the modified section using stealth dicing as its starting point, and the modified section is removed during backside grinding. Thus, it is possible to reduce front and backside chipping and produce thin die with a high die strength.
Photograph of the side wall of a die Die strength (Three-point bending)
High Quality Separation of DAF (Die Attach Film)
By expanding DAF using the die separator (DDS2300) in a low temperature environment, it is possible to achieve high quality separation.
Dicing tape sag after expansion is eliminated using heat shrink, making it possible to transfer the die to the next die bonding process without re-laminating the dicing tape.
Example of DAF Separation which performed using DDS2300
♦ Die to Die: It is applied for adhesion between die when multiple die is laminated.
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