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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics

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Kiru, Kezuru, Migaku Topics
The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG Others
Introducing various stress relief techniques with potential to compensate for die strength decline and increase in warpage amount, which are major issues associated with wafer thinning.
Stress Relief (Dry Polishing)
DBG & Dry Etcher Process Flow
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