DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics

Solutions


Kiru, Kezuru, Migaku Topics

The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG / SDBG Others
Introducing various stress relief techniques with potential to compensate for die strength decline and increase in warpage amount, which are major issues associated with wafer thinning.
Stress Relief (Dry Polishing)
DBG & Dry Etcher Process Flow
  Solutions

Kiru, Kezuru, Migaku Topics
 
 
Applications Example
 
 
DISCO Technical Review
 
 
Solutions Support
 
 

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top