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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics > Cutting and Planarization Using a Surface Planer

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Cutting and Planarization Using a Surface Planer

The DFS8910 surface planer has been developed for the high-precision planarization using a diamond bit of ductile materials(such as gold, copper and solder), resin(such as photoresist and polyimide), and composites of these materials.
Advantages of the surface planer
Achieves high-precision cutting and planarization using a diamond bit
Because cutting is used, high-quality processing is possible even for composite materials such as resins and metals
Raises productivity and minimizes costs by partially replacing CMP processes
Flash movie
Examples of surface planer processing
Cutting metal plated bumps(LCD driver IC)
By cutting bumps, the DFS8910 eliminates bump dents and shoulder overhangs, and solves the issues of bump height variation and surface roughness.This increases the ACF(Anisotropic Conductive Film) effective capture area on the bump surface.
Cutting metal plated bumps(LCD driver IC)
Batch cutting of copper pillars and resin(pillar exposure)
The DFS8910 cuts resin in which copper pillars are embedded and exposes the pillars.The planarization of the top surfaces of these pillars increases the reliability of connection with other devices.We are also studying a connection method in which the planarization and exposure of solder bumps are performed for each resin piece.
Batch cutting of copper bumps and resin(pillar exposure)
Before cutting
Before cutting
After cutting
After cutting
Replacing CMP processes
Usually, CMP is used for planarization when batch planarization is performed for copper wiring formed on wafers and insulating film, and a wiring layer is then placed on top.Using the DFS8910 in this process achieves a throughput that is even better than CMP. Also, because slurry is not used, wastewater processing costs and environmental burdens are reduced.
Replacing CMP processes
Examples of other processes
- Checking solder bump quality
In defect inspections for solder bumps, the existence of voids is usually judged from an X-ray image of the bumps.When the DFS8910 is used, the bump is directly cut, so the actual void condition inside the solder bumps can be checked.
Before cutting
Before cutting
After cutting
After cutting
- Improving the plating(gold, copper)
When performing electroplating, such as for electrodes, irregularities can occur on the plating and result in a bumpy and uneven surface.By cutting this plated surface with the DFS8910, an even and planarized surface can be achieved.
Before cutting
Before cutting
Before cutting
After cutting
After cutting
After cutting
Equipment
Fully Automatic Surface Planer DFS8910
DFS8910
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