The TAIKO process is the name of a wafer back grinding process that uses a new grinding method developed by DISCO. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. By using this method, it lowers the risk of thin wafer handling and lowers warpage.
“TAIKO Process” merits
By leaving a frame on the outer circumference of the wafer
Lowers wafer warpage
Improves wafer strength
Improves the ease of wafer handling
Improves the ease of processing (through hole formation, bump distribution, etc) after thinning
Advantage of integrated structure# compare to a hard substrate
When a high-temperature process (metallization, etc) is required after wafer thinning, out gas does not occur.
Lower introduction of particles due to integrated structure and simple shape
# The wafer can maintain its structure (shape) without using a hard substrate.
Wafer hold based on hard substrate
Advantages of not putting a load on the outer circumference when grinding
Easy to grind a wafer with a step on the outer circumference