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DISCO HOME > News Releases > Event Schedule > SEMICON Japan 2010 > Exhibition Information

SEMICON Japan 2010


Exhibition Information

The DISCO booth at this year's SEMICON will focus on our leading-edge dicing solutions, laser technology, and wafer thinning processes, with products that contribute to the improvement of productivity, remarkable applications for high brightness LED, and the processing of non-silicon materials.
We will also be the showcasing of our actual systems and products, including precision processing tools and deionized water recycling system.
By corner By product
Laser Saws
DFL7161
DFL7340
DFL7020
DAL7020
Fully Automatic Dicing Saws
DFD6760
DFD6341
DFD6362
ABC(Automatic Blade Changer)
DFD6240
Semi-Automatic Dicing Saws
DAD3240 New!
DAD322
DAD3350
DAD3230
Grinder / Polisher / Mounter
DGP8761
DFM2800
Automatic Surface Planer
DAS8920
Deionized Water Recycling Unit
DWR1721 New! (Reference display)
Automatic Cleaning System
DCS1440 with High Level Cleaning Specification (Reference display)
A DCS1440 with high level cleaning option is scheduled to be on display.
Dicing Blades
ZHZZ
ZH05
ZHCR
ZHDG New!
BH11 New!
P08
B1A
VT07
ZP07
Z05
Z09
Grinding Wheels
BT300
UltraPoligrind
GS08 
Dry Polishing Wheel
Gettering DP
DP08
SEMICON Japan


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