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DISCO HOME > Solutions > Applications Example > Dicing

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Applications Example


SiC Dicing using the ZP Blade
 
When processing an SiC (silicon carbide) workpiece using a conventional electroformed blade, the blade tends to be glazed because this material is very hard. Such blade condition may cause chipping or cracking of the workpiece or blade breakage. The ZP blade, on the other hand, can demonstrate the excellent cutting ability for SiC, specific to the electroformed bond, while maintaining an adequate self-sharpening performance, because pores are formed in the bond. This makes it possible to simultaneously provide a high level of continuous processability and process quality when dicing SiC.


Process Example
Use of the ZP blade greatly improves the backside chipping condition.

Photo 1:
Backside when processed with the ZP blade
ZPブレード加工裏面
Photo 2:
Backside when processed with the Z blade
Zブレード加工裏面
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