Solutions

Applications Example

Stable Grinding of 6-inch AlTiC Wafers

Stable grinding is now possible for the 6-inch AlTiC wafers used in the HDD head substrate and other components.

Process Example

Selection of optimum grinding conditions and wheel type enables stable grinding of a 6-inch wafer, which is a large size for AlTiC.


Fig. 1 shows the wafer thickness dispersion when grinding a 6-inch AlTic wafer.



Fig. 1: Wafer Thickness Dispersion	Fig. 2: Thickness Measurement Positions

Fig. 3 shows the surface roughness of an AlTiC wafer that has undergone finish grinding by a #3000 wheel.

Fig. 3: AlTiC 6-inch #3000 Wheel Finish
Ra=0.003µm
Ry=0.044µm

Fig. 4 shows the results when the above wafer is measured by AFM.

Fig. 4: AFM Measurement Results