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DISCO HOME > Product Information > Grinding Wheels > Poligrind

Product Information


Poligrind

Poligrind Catalog
Poligrind offers a new dimension in ultra-high-quality grinding.
Grinding Wheel GF01 Series Poligrind, the latest addition to DISCO's lineup of precision grinding wheels, is designed to be used on the second spindle of precision in-feed grinders. Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface roughness, die strength, and overall process quality.

Features
  • Can be used with current grinding equipment.
  • Improves die strength and other quality factors using current processes.
  • Employs extremely fi ne grit to offer ultra-high-quality grinding results.
  • Newly developed bond allows for high-load processing.

Applicable Workpieces
Silicon wafers.

Applicable Machines
DAG800 Series, DFG800 Series and DFG8000 Series grinders DGP8000 Series polishers

Assistance with Using Poligrind
To achieve the best processing results possible with Poligrind, correct formulation of the application is required. DISCO's applications engineers will be happy to work with your workpiece and specifications to achieve the desired processing results.

Specifications

Note: The product name display for the Poligrind wheel has been updated. Customers that are using the old product name will continue to be provided with the old product name.

Comparative Data with Previous Wheels
Compared to previous wheels, Poligrind-with its ultra-fine grit and newly developed bond-helps improve die strength, reduce surface roughness, and improve overall process quality.

Die strength (ball point breakage test)


Workpiece : ø8" sillicon mirror wafer
Z2 removal amount : 35 µm
Final thickness : 200 µm

Warpage level

Fine grinding wheel Poligrind #2000 B-K09

Warpage level 3.5 mm 14.0 mm
 
Workpiece : ø8" sillicon mirror wafer
Z2 removal amount : 35 µm
Final thickness : 50 µm

Surface roughness

Fine grinding wheel Poligrind #2000 B-K09

Ra(µm) 0.0141 0.0240

Rmax(µm) 0.1153 0.1734
 
Workpiece : ø8" sillicon mirror wafer
Z2 removal amount : 35 µm
Measurement position : wafer center
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