Product Information

Product for Dicing Before Grinding (DBG) Process

For more information about DBG, please click here.

The DBG in-line system separates large wafers into exceptionally high-quality die while minimizing backside chipping, wafer handling, and wafer breakage.

The DBG in-line system comprises the following machines:

Half-cut dicer
Protective tape laminator
DBG grinder
DBG mounter (manufactured by Lintec Corporation)

Half-cut dicer

Designed especially for DBG, the half-cut dicer features tape-free wafer handling and high-precision grooving with extremely low depth variation. The half-cut dicer can also operate as a standard tape-based dicer when special adjustments are made.

Applicable Models:

DFD641, DFD651, DFD6361

DBG grinder

DBG-specification grinders have several special features for transporting and grinding grooved wafers: notch-detection software, settable chuck table resting point, and all-wafer vacuum transport. After grinding, the robot arm transfers the wafer to the DBG Mounter.

Applicable Models:

All DISCO grinders

DBG In-line System

The DBG In-line System performs grooving, die separation, dicing frame mounting, and protective tape peeling in one smooth process using a special DISCO DBG grinder and Lintec Corporation-made DBG mounter. The DBG mounter transfers the separated die to a dicing frame and gently and safely removes the protective grinding tape.

Applicable Models:	DFM2700 (300 mm; includes DAF lamination function) DFM2800 (300 mm) LTD-2500F/8 (8") LTD-2500F/12 (300 mm)
For more information about DFM2700 and DFM2800, please click here.

Precision Machines

Dicing and Cutting Saws

Laser Saws

Grinders

Polishers and Dry Etchers

Surface Planer

WaterJet Saw

Products for New Processes

Products for DBG Process

Products for Package Singulation

Precision Processing Tools

Dicing Blades

Grinding Wheels

Dry Polishing Wheels

Other Products

Accessory Equipment

Product Information

Product for Dicing Before Grinding (DBG) Process