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Grinders
Grinder
Fully Automatic Grinder 8000 Series
Details
Fully Automatic Grinder DFG830
Details
Automatic Grinder DAG810
Details
Maximum Workpiece size
Number of Spindle axes
Number of chuck tables
Application
Grinder
800 Series
DAG810
8"
1
1
Dual-side wafer grinding and lowered TTV
DFG830
*
8"
2
2
Grinding of semiconductor devices, ceramics, etc.
8000 Series
DFG8540
8"
2
3
Ultra-thin back-side grinding (100 µm or less)
DFG8560
300 mm
2
3
(*) Discontinued Machines
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Fully Automatic 8000 Series
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Automatic 800 Series
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